ProWarm High-Density Chipboard Overlay Panel
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Add your area dimensions and we'll calculate how many boards you need
Add your area dimensions and we'll calculate how many boards you need

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Description
Description
The ProWarm High-Density Chipboard Overlay Panel is designed to complement the ProWarm ProFloor Foil-Faced OSB Board in water-based underfloor heating systems. Engineered for durability, thermal efficiency, and easy installation, this panel offers a smooth, stable surface for various floor coverings, making it an ideal solution for both new build and retrofit projects.
Key Benefits
- Optimised for Underfloor Heating: Designed to work seamlessly with water-based systems, ensuring consistent heat transfer and protection for the pipes beneath.
- Dense and Durable Construction: Made from High Density Fibreboard (HDF) and chipboard for maximum strength, rigidity, and longevity under daily wear.
- Excellent Heat Distribution: The compact structure enhances thermal conductivity, improving energy efficiency and warm-up times.
- Slim Profile: Low build height makes it perfect for renovations where ceiling height or door clearance is a concern.
- Easy to Install: Printed pipe channels and marked screw positions allow for quick alignment and fitting over existing underfloor pipe layouts.
- Versatile Surface: Provides a smooth, even base suitable for floor coverings such as laminate, vinyl, engineered wood, or carpet (with suitable underlay).
- 10-Year Warranty: Long-lasting confidence in performance and durability.
Product Features
- Board Size: 1200mm x 600mm
- Material: High Density Fibreboard (HDF) combined with chipboard for enhanced structural support
- Surface: Smooth overlay surface for floor finish installation
- Pipe Channel Guidance: Printed layout for quick and accurate alignment with ProFloor OSB boards
- Application: Designed for use over 16mm pipe systems installed in ProWarm ProFloor boards
This overlay panel not only protects underfloor heating pipes from above, but also acts as a thermal conductor, ensuring heat is evenly distributed across the floor. The high-density composition allows heat to transfer efficiently while withstanding foot traffic and floor finish installation.
Applications
- Residential homes, including living rooms, kitchens, and bathrooms
- Commercial spaces such as offices and retail environments
- New builds and retrofit projects
- Suitable for vinyl, laminate, engineered wood, and carpet (with correct underlay)
The ProWarm High-Density Chipboard Overlay Panel is a reliable and energy-efficient addition to your underfloor heating setup. Its durable construction, low profile, and easy installation make it the perfect finishing layer above your heating system. Designed for seamless compatibility with ProWarm ProFloor OSB boards, this panel offers long-term performance, excellent heat transfer, and support for a wide range of floor finishes.
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